CHINDA, Akira: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Selective and Anisotropic Copper Electroplating Using Copper Overburden with an Inhibiting Additive

Haba, Toshio, Suzuki, Hitoshi, Yoshida, Hiroshi, Akahoshi, Haruo, Chinda, Akira

Journal:

Electrochemical and Solid-State Letters

Year:

2010

Language:

english

File:

PDF, 427 KB

english, 2010

2

Effect of Copper Strike Plating on Adhesion of Interface between Silver and Nickel Plating after Thermal Treatment.

CHINDA, Akira, YOSHIOKA, Osamu

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1994

Language:

english

File:

PDF, 489 KB

english, 1994

3

Thermal Diffusion Behavior of Copper Strike Plating between Silver and Nickel Plating in Nitrogen.

CHINDA, Akira, YOSHIOKA, Osamu

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1994

File:

PDF, 526 KB

1994

4

Effect of the Pulse Plating of Nickel-Plated Underlayers on the Corrosion Resistance of Palladium-Plated Ferro-Alloy.

CHINDA, Akira, YOSHIOKA, Osamu, KOIZUMI, Ryoichi

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1994

File:

PDF, 1.34 MB

1994

5

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Advanced trench filling process by selective copper electrodeposition for ultra fine printed wiring board fabrication

Nakano, Hiroshi, Suzuki, Hitoshi, Haba, Toshio, Yoshida, Hiroshi, Chinda, Akira, Akahoshi, Haruo

Year:

2010

Language:

english

File:

PDF, 1.04 MB

english, 2010

6

Comparison of the Corrosion Behavior of Pure Fe, Ni, Cr, and Type 304 Stainless Steel in Formic Acid Solution

Sekine, Isao, Chinda, Akira

Journal:

Year:

1984

Language:

english

File:

PDF, 508 KB

english, 1984

7

Influence of Electroless Gold Plating Thickness on Wire Bondability and Ball Solderability on Tape Substrate for BGA Packages.

CHINDA, Akira, MIYAMOTO, Nobuaki, YOSHIOKA, Osamu

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1998

File:

PDF, 2.66 MB

1998

8

Investigation of Corrosion Resisted Electroplating Films for Electronic Component's Materials

Journal:

Zairyo-to-Kankyo

Year:

1997

File:

PDF, 3.78 MB

1997

9

Characteristics of Palladium Plated Lead Frames after Thermal Treatment.

CHINDA, Akira, YOSHIOKA, Osamu, KOIZUMI, Ryoichi

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1993

Language:

english

File:

PDF, 946 KB

english, 1993

10

New Trends of Plating Technology

EBINA, Nobuo, KOGA, Takaaki, KOBAYASHI, Michio, SENDA, Atsuo, CHINDA, Akira, SERITA, Kazuo

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1996

File:

PDF, 5.55 MB

1996

11

Effect of Additives in Organic Acid Bath of Electroless Solder Plating; Studies of Complexing Agents.

YUASA, Makoto, MATSUMOTO, Katsuyuki, MASUDA, Akihiro, KUMEUCHI, Tomokazu, SUGIYAMA, Takashi, SEKINE, Isao, YOSHIOKA, Osamu, CHINDA, Akira

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1993

File:

PDF, 2.09 MB

1993

12

Effect of Additions on Organic Acid Bath for Displacement Solder Plating. (Part 2); Surfactants and Oxidation Inhibitors.

YUASA, Makoto, SAITOU, Masami, KUMEUCHI, Tomokazu, MATSUMOTO, Katsuyuki, SEKINE, Isao, CHINDA, Akira, YOSHIOKA, Osamu

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1993

File:

PDF, 1.12 MB

1993

13

Corrosion Behavior of Stainless Steel 304 in Formic Acid Solution

Sekine, Isao, Chinda, Akira

Journal:

CORROSION ENGINEERING

Year:

1982

Language:

english

File:

PDF, 1.64 MB

english, 1982

14

Preparation of Amorphous Ni-Mo-W Ternary Alloy Films by Electrodeposition and Their Corrosion Resistance.

MATSUMOTO, Katsuyuki, YUASA, Makoto, SEKINE, Isao, YOSHIOKA, Osamu, CHINDA, Akira

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1993

File:

PDF, 2.27 MB

1993

15

Effect of pulse plating on the Tl content of gold deposits.

CHINDA, Akira, YOSHIOKA, Osamu

Journal:

Journal of the Metal Finishing Society of Japan

Year:

1988

Language:

english

File:

PDF, 1.07 MB

english, 1988

16

Influence of Nickel Plating Uuderlayer Deposition Conditions on Bending Characteristics of Palladium Plating Leadframe.

CHINDA, Akira, AKINO, Hisanori, YONEKAWA, Takuya

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1998

Language:

english

File:

PDF, 3.04 MB

english, 1998

17

10.4139/sfj.54.728

Journal:

Journal of The Surface Finishing Society of Japan

Year:

2003

File:

PDF, 1.77 MB

2003

18

COF Tape for Large-scale LCD with Active Development of Fine Pitch Wiring Formation

Journal:

Journal of The Surface Finishing Society of Japan

Year:

2008

File:

PDF, 647 KB

2008

19

10.4139/sfj.54.118

Journal:

Journal of The Surface Finishing Society of Japan

Year:

2003

File:

PDF, 1.87 MB

2003

20

10.4139/sfj.62.422

Journal:

Journal of The Surface Finishing Society of Japan

Year:

2011

File:

PDF, 1.20 MB

2011

21

LGA Type Ultra Thin Package Using Peelable Copper Foil

CHINDA, Akira, MIYAMOTO, Nobuaki, HIRASAWA, Koki, UCHIDA, Kenji

Journal:

Journal of Japan Institute of Electronics Packaging

Year:

2007

File:

PDF, 4.66 MB

2007

22

Dynamic analysis of human small intestinal microbiota after an ingestion of fermented milk by small-intestinal fluid perfusion using an endoscopic retrograde bowel insertion technique

Takada, Toshihiko, Chinda, Daisuke, Mikami, Tatsuya, Shimizu, Kensuke, Oana, Kosuke, Hayamizu, Shiro, Miyazawa, Kuniaki, Arai, Tetsu, Katto, Miyuki, Nagara, Yusuke, Makino, Hiroshi, Kushiro, Akira, Oi

Journal:

Year:

2020

File:

PDF, 3.69 MB

2020